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EXTRACTION OF DEFECT IN DOPING SILICON WAFER BY ANALYZING THE LIFETIME PROFILE METHOD

 

The total leakage current in silicon p-n junction diodes compatible with 0.8 μm CMOS technology is investigated. The generation lifetime is a key parameter for the leakage current, which can be obtained from the current-voltage (I-V) and the capacitance-voltage (C-V) characteristics. As will be shown, the electrically active defect from ion implantation process nerated in p-n junction can be extracted from the generation current density.

 

 

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Post on 2009-06-14 | View 18348

 

 

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High-dielectric constant AlON prepared by RF gas-timing sputtering for high capacitance density

Post on 2009-06-14

 

 

This paper presents the method to prepare and characterize high-dielectric constant aluminum oxynitride (AlON) formed by RF gas-timing sputtering. AlON layers of 725nm have been pr...

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